Haina Lean is an entity enterprise that specializes in electronic product design and development, supply chain management, PCBA and one-stop (OEM) production services for complete machine products. Also it owns profuse experience in manufacturing PCB,owned experienced technical R & D technology team, young and professional sales and customer service team, experienced and professional procurement team and assembly testing team, which make sure the products quality of the pass rate, on-time delivery rate of customer orders. Welcome to visit our factory!
PCB project
PCB design
PCB manufacture
PCB Solutions
PCB Assembly
Box Assembly
PCB CAPABILITIES
FACTORY CAPABILITIES | |||
No. | Items | 2019 | 2020 |
1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
2 | Max layer count | 32L | 36L |
3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
Mechnical 0.15mm | Mechnical 0.15mm | ||
5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
7 | Size Max Panel size | 700x610mm | 700x610mm |
8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
10 | Min.BGA PAD | 0.15mm | 0.125mm |
11 | Max Aspect Ratio | 10:1 | 10:1 |
12 | Bow and Twist | 0.50% | 0.50% |
13 | Impedance Control Tolerance | +/-8% | +/-5% |
14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA Capability | |||
Material Type | Item | Min | Max |
PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
Components | Chip&IC | 1005 | 55mm |
BGA Pitch | 0.3mm | - | |
QFP Pitch | 0.3mm | - |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in Military-Industrial sphere ,Automotive /automobile , Medical .Communication Solution, Industrial Control, Aerospace , image processing ,video processing technology ,smart home ,securit etc.
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box